MMSZ5221BS-MMSZ5262BS Surface mount zener diode Pb FEATURES Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLICATIONS z Zener diode z Ultra-small surface mount package Dimensions in inches and (millimeters) M.
Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLICATIONS z Zener diode z Ultra-small surface mount package Dimensions in inches and (millimeters) MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Forward Voltage @ IF=10mA VF 0.9 Power Dissipation Thermal resistance,junction to ambient air Pd RθjA 200 625 Junction temperature Tj 150 Storage temperature range Tstg -65 to+150 Notes: 1. Valid provided that device terminals are kept at ambient temperature. 2. Teste.
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