4GB e-MMC Module
THGBM4G5D1HBAIR
TOSHIBA e-MMC Module
4GB THGBM4G5D1HBAIR INTRODUCTION
THGBM4G5D1HBAIR is 4-GByte density of e-MMC Module...
Description
THGBM4G5D1HBAIR
TOSHIBA e-MMC Module
4GB THGBM4G5D1HBAIR INTRODUCTION
THGBM4G5D1HBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G5D1HBAIR has an industry standard MMC protocol for easy use.
FEATURES
THGBM4G5D1HBAIR Interface
THGBM4G5D1HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Ball / Signal Allocation
P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
11 NC NC NC
NC NC NC
10 NC NC NC
RFU RFU RFU Vss Vcc RFU
NC NC RFU
9 NC NC NC
RFU
Vcc NC NC NC
8 NC NC NC 7 RFU NC NC
RFU
Vss
Top View
Vss RFU
NC NC NC NC NC RFU
6 RFU DAT7 VccQ
Vcc
RFU
CLK NC VssQ
5 DAT2 DAT6 RFU
RFU Vcc Vss RFU RFU RST_n
CMD VssQ VccQ
4 DAT1 DAT5 VssQ NC Index
VccQ VccQ VssQ
3 DAT0 DAT4 NC NC NC NC RFU NC NC NC NC NC NC VccQ
2 NC DAT3 VDDi NC NC NC NC NC NC NC NC NC VssQ NC
1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
ABCD E FGH J K LMN P
Pin Number
Name
Pin Number
Name
Pin Number
A3 DAT0 C2 VDDi J10
A4 DAT1 C4 VssQ K5
A5 DAT2 C6 VccQ K8
B2 DAT3 E6 Vcc K9
B3 DAT4 E7 Vss M4
B4 DAT5 F5 Vcc M5
B5 DAT6 G5 Vss M6
B6
DAT7
H10
Vss
N2
NC: No Connect, can be connected to ground or left floating. RFU: Reserved for Future Use, should be...
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