MMBD4448HADW

Surface Mount Switching Multi-Chip Diode Array P b Lead(Pb)-Free MMBD4448HAQW MMBD4448HSDW MMBD4448HADW MMBD4448HTW MMBD4448HCDW MULTI-CHIP DIODES 500m AMPERES 100 VOLTS Features: * Fast Switching Speed * Ultra-Small Surface Mount Package * For General Purpose Switching Applications * High Conductance Power Dissipation Mechanical Data: * Case : SOT-363 * Case Material : Molded Plastic. UL Flammability Classification Ration 94V-0 * Moisture Sensitivity : Level 1 per J-STD-020C * Terminals : Solderable per MIL-STD-202, Method 208 * Polarity : See Diagram * Weight : 0.006 grams(appro) 6 54 123 SOT-363 SOT-363 Outline Dimensions A 6 54 1 23 BC E D H K J L M Unit:mm SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 REF E 0.30 0.40 H 1.80 2.20 J- 0.10 K 0.80 1.10 L 0.25 0.40 M 0.10 0.25 WEITRON http://www.weitron.com.tw 1/4 04-Jan-06 MMBD4448HAQW MMBD4448HSDW MMBD4448HADW MMBD4448HTW MMBD4448HCDW Maximum Ratings@ TA= 25°C unless otherwise specified Characteristic Symbol Non-Repetitive Peak Reverse Voltage VRM Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 1) VRRM VRWM VR VR(RMS) IFM Average Rectified Output Current (Note 1) IO Non-Repetitive Peak Forward Surge Current@ t = 1.0µs @ t = 1.0s IFSM Power Dissipation (Note 1) Thermal Resistant Junction to Ambient Air (Note 1) PD RθJA Operating Temperature Range Tj Storage Temperature Ra...