Surface Mount Switching Multi-Chip Diode Array
Surface Mount Switching Multi-Chip Diode Array
P b Lead(Pb)-Free
MMBD4448HAQW MMBD4448HSDW MMBD4448HADW MMBD4448HTW MMB...
Description
Surface Mount Switching Multi-Chip Diode Array
P b Lead(Pb)-Free
MMBD4448HAQW MMBD4448HSDW MMBD4448HADW MMBD4448HTW MMBD4448HCDW
MULTI-CHIP DIODES 500m AMPERES 100 VOLTS
Features: * Fast Switching Speed * Ultra-Small Surface Mount Package * For General Purpose Switching Applications * High Conductance Power Dissipation
Mechanical Data: * Case : SOT-363 * Case Material : Molded Plastic. UL Flammability
Classification Ration 94V-0 * Moisture Sensitivity : Level 1 per J-STD-020C * Terminals : Solderable per MIL-STD-202, Method 208 * Polarity : See Diagram * Weight : 0.006 grams(appro)
6 54
123
SOT-363
SOT-363 Outline Dimensions
A
6 54 1 23
BC
E D
H K
J
L
M
Unit:mm
SOT-363
Dim Min
Max
A 0.10
0.30
B 1.15
1.35
C 2.00
2.20
D 0.65 REF
E 0.30
0.40
H 1.80
2.20
J-
0.10
K 0.80
1.10
L 0.25
0.40
M 0.10
0.25
WEITRON
http://www.weitron.com.tw
1/4
04-Jan-06
MMBD4448HAQW MMBD4448HSDW MMBD4448HADW MMBD4448HTW MMBD4448HCDW
Maximum Ratings@ TA= 25°C unless otherwise specified
Characteristic
Symbol
Non-Repetitive Peak Reverse Voltage
VRM
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
VRRM VRWM
VR VR(RMS)
IFM
Average Rectified Output Current (Note 1)
IO
Non-Repetitive Peak Forward Surge Current@ t = 1.0µs @ t = 1.0s
IFSM
Power Dissipation (Note 1) Thermal Resistant Junction to Ambient Air (Note 1)
PD RθJA
Operating Temperature Range
Tj
Storage Temperature Ra...
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