Preliminary THGBM4G6D2HBAIR
8GB THGBM4G6D2HBAIR
TOSHIBA e-MMC Module
INTRODUCTION
THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use.
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