Features |
w.datasheet4u.com/
MEM2309
Thermal Characteristics:
Parameter Thermal Resistance, Junction-to-Ambient
3
Symbol RθJA
Ratings 50
Unit ! /W
Electrical Characteristics:
MEM2309SG
Parameter Drain-Source Breakdown Voltage Gate Threshold Voltage
Gate-Body Leakage Zero Gate Voltage Drain Current Static Drain-Source On-Resistance Forward Transconductance Drain-Source Diode Forward Current Source-drain (diode forward) voltage
Symbol Test Condition Static Characteristics VGS=0V, V(BR)DSS ID=-250uA VDS= VGS, VGS(th) ID=-250uA VDS=0Vÿ VGS=20V IGSS VDS=0Vÿ VGS=-20V VDS=-24V IDSS VGS=0V RDS(ON)1 VGS=.
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Distributor | Stock | Price | Buy |
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No. | Part # | Manufacture | Description | Datasheet |
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TDK |
SMD |
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TDK |
SMD |
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TDK |
SMD |
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TDK |
SMD |
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TDK |
SMD |
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TDK |
EMC Components |
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ETC |
4 MEG x 16 EDO DRAM |
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Siliconix |
p-channel MOSFET |
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Siliconix |
p-channel MOSFET |
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MITSUMI |
1cell Li-ion/Li-polymer battery protection |
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DECA |
Closed ends Header |
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Lumberg |
Pluggable terminal blocks |
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