The miniature surface mount MOSFETs utilize a high cell density trench process To provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA car.
Low RDS(on) provides higher efficiency and extends battery life.
Low thermal impedance copper leadframe SC-59 saves board
space.
Fast switching speed.
High performance trench technology.
K F
SC-59
A
L
3
Top View
1
E
2
CB
1
D G
H
3 2
J
PRODUCT SUMMARY
PRODUCT SUMMARY
VDS(V) -30
RDS(on) ( 0.057@VGS= -10V 0.089@VGS= -4.5V
ID(A)
-3.6 -2.8
REF.
A B C D E F
Millimeter
Min. 2.70 2.25 1.30
Max. 3.10 3.00 1.70
1.00 1.40
1.70 2.30
0.35 0.50
REF.
G H J K
L
Millimeter
Min. Max. 0.10 REF. 0.40 REF.
0.10 0.20 0.45 0.55
0.85 1.15
PACKAGE INFORMATION
Package
MPQ
SC-59
3K.
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