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Assembly Die Process ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE TABLES Overall Evaluation Package Markings Wirebond Strength Die Material Analysis Horizontal Dimensions Vertical Dimensions PAGE 1 1 2 2-3 4 5-7 8 9 10 10 10 11 12 -i- www.DataSheet.
• Titanium silicided diffusion structures.
1These items present possible quality or reliability concerns.
They should be discussed with the manufacturer to determine their possible impact on the intended application. depends on design margins. -1-
2Seriousness
www.DataSheet4U.com
TECHNOLOGY DESCRIPTION Assembly:
• Device was encapsulated in a 144-pin plastic Square Quad Flat Package (SQFP).
• Copper (Cu) leadframe was internally plated with silver (Ag).
• External pins were tinned with tin-lead (SnPb) solder.
• Lead-locking provisions (holes) at all pins.
• Thermosonic ball bonding using.
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