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FBGA-SD |
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| Part Number | FBGA-SD |
| Manufacturer | STATS ChipPAC |
| Description | STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages. Tape versions of VFBGA-SD and TFBGA-SD are also available. STATS ... |
| Features |
• 2 die to 7 die stack with spacer capability • 5 x 5mm to 23 x 23mm body size • Package height at 1.0, 1.2, 1.4 and 1.7mm max. • Flexible die stacking options (“pyramid,” “same die,” etc.) • 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball • Flash/SRAM/PSRAM/Logic/Analog combinations • JEDEC standard package outlines • Die thinning to 75um (3mils) capability • Low loop wire bonding; reverse and die to die • Up to 2mm die overhang per side • Halogen-free and Low-K wafer compatible BOM • Ball counts up to 450 balls DESCRIPTION STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die... |
| Document |
 FBGA-SD Data Sheet
PDF 589.36KB |
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| No. | Part # | Manufacture | Description | Datasheet |
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STATS ChipPAC |
Fine Pitch Ball Grid Array |
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TopLine |
FBGA96T.5-DC144 |
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