ZMD31010 RBicLite Low-Cost Sensor Signal Conditioner

ZMD31010 RBicLite Low-Cost Sensor Signal Conditioner

www.DataSheet4U.com ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY ZMD31010 RBicLite™ Technical Notes Die Dimensions and Pad Coordinates Contents 1 2 3 RBICLITE™ DIE DIMENSIONS.................................................

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inary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes
  – Die Dimensions and Pad Coordinates PRELIMINARY 1 RBicLite™ Die Dimensions
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• Die size (including scribeline): 2230 µm x 1681 µm ≈ 3.75sqmm Core die size (without scribeline): Die thickness: 390µm Scribeline (distance between two core dice on wafer): 150µm Pads size: 68µm x 68µm 2080 µm x 1531 µm ≈ 3.19 sqmm Preliminary Tech. Notes
  – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 2 of 4 © ZMD AG, 2005 All rights reserved. The material contained herein .