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MR18R1622DF0

Part Number	MR18R1622DF0
Manufacturer	Samsung semiconductor
Description	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
Features	♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x ...
Published	Jan 19, 2006
Datasheet	MR18R1622DF0 PDF File

Features

♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x 31.75mm x 1.27mm

(5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800 RIMM Module ♦ Module PCB size : 133.35mm x 34.93mm x 1.27mm...

Similar Datasheet

MR18R1622DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters - Samsung semiconductor
MR18R1622DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters - Samsung semiconductor

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