2.3 Addressing 3. Absolute Maximum Rating 4. AC & DC Operating Conditions & Specifications Page 2 of 27 Rev. 1.5 Feb. 2005 256Mb F-die DDR2 SDRAM 0. Ordering Information Organization 64Mx4 64Mx4 32Mx8 32Mx8 DDR2-667 5-5-5 K4T56083QF-GCE6 K4T56083QF-ZCE6 DDR2-533 4-4-4 K4T56043QF-GCD5 K4T56043QF.
Speed CAS Latency tRCD(min) tRP(min) tRC(min) DDR2-667 5-5-5 5 15 15 54 DDR2-533 4-4-4 4 15 15 55 DDR2-400 3-3-3 3 15 15 55 Units tCK ns ns ns
• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin
• 4 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Sin.
Distributor | Stock | Price | Buy |
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No. | Part # | Manufacture | Description | Datasheet |
---|---|---|---|---|
1 | K4T56083QF |
Samsung |
256Mb F-die DDR2 SDRAM | |
2 | K4T56163QN |
Samsung |
256Mb N-die DDR2 SDRAM | |
3 | K4T51043Q |
Samsung |
512Mb B-die DDR2 SDRAM | |
4 | K4T51043QB-GCD5 |
Samsung semiconductor |
512Mb B-die DDR2 SDRAM | |
5 | K4T51043QB-ZCD5 |
Samsung semiconductor |
512Mb B-die DDR2 SDRAM | |
6 | K4T51043QE |
Samsung semiconductor |
512Mb E-die DDR2 SDRAM Specification | |
7 | K4T51043QG |
Samsung |
512Mb G-die DDR2 SDRAM | |
8 | K4T51043QI |
Samsung |
512Mb I-die DDR2 SDRAM | |
9 | K4T51043QJ |
Samsung |
512Mb J-die DDR2 SDRAM | |
10 | K4T51083QB-GCD5 |
Samsung semiconductor |
512Mb B-die DDR2 SDRAM | |
11 | K4T51083QB-ZCD5 |
Samsung semiconductor |
512Mb B-die DDR2 SDRAM | |
12 | K4T51083QC |
Samsung |
512Mb C-die DDR2 SDRAM | |
13 | K4T51083QE |
Samsung semiconductor |
512Mb E-die DDR2 SDRAM Specification | |
14 | K4T51083QG |
Samsung |
512Mb G-die DDR2 SDRAM | |
15 | K4T51083QI |
Samsung |
512Mb I-die DDR2 SDRAM |