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® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissip.
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| Distributor | Stock | Price | Buy |
|---|
| No. | Part # | Manufacture | Description | Datasheet |
|---|---|---|---|---|
| 1 | DIP20 |
ETC |
Thermal Data |
|
| 2 | DIP24-1A72-11 |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 3 | DIP24-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 4 | DIP24-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 5 | DIP24-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
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