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1N5806D2 |
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| Part Number | 1N5806D2 |
| Manufacturer | TT |
| Description | SCHOTTKY RECTIFIER DIODE 1N5806D2 Variant Options D2A to D2H • Hermetic Ceramic Package Designed as a DropIn Replacement for D-5A MELF Package • Designed For High Rel Applications • Screening Options ... |
| Features |
to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT D-5A
A
C
B
DIMENSION
mm
A
6.25
B
1.70
C
2.67
Inches 0.246 0.067 0.105
Soldering temperature should be 260°C for a maximum of 10 seconds.
PACKAGE MASS Gold Plated Solder Pad Finish = 83mg
DLCC2/ D-5A MELF OVERLAY
The physical dimensions for the DLCC2 ceramic package are designed to be different from the published dimensions for the “D5A” and “B-MELF” outlines. The DLCC2 design fully utilises the recommended solder footprint for the “D-5A” / “B-MELF” Package, an... |
| Document |
 1N5806D2 Data Sheet
PDF 456.31KB |
| Distributor | Stock | Price | Buy |
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| No. | Part # | Manufacture | Description | Datasheet |
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Microsemi |
VOIDLESS HERMETICALLY SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS |
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Semtech |
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EIC |
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MA-COM |
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Sensitron |
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