GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA • Case: Molded Glass MI.
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
MINI-MELF / LL-34
0.063(1.6) 0.055(1.4) DIA.
0.020(0.5) 0.012(0.3)
0.146(3.7) 0.130(3.3)
0.020(0.5) 0.012(0.3)
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ )
Sy.
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