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MA4SPS502

MA-COM
Part Number MA4SPS502
Manufacturer MA-COM
Description PIN Diode
Published Mar 23, 2019
Detailed Description MA4SPS502 SURMOUNTTM PIN Diode Rev. V3 Features  Surface Mount Device  No Wire Bonding Required  Rugged Silicon-Gl...
Datasheet PDF File MA4SPS502 PDF File

MA4SPS502
MA4SPS502

Overview
MA4SPS502 SURMOUNTTM PIN Diode Rev.
V3 Features  Surface Mount Device  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS* Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2 Description and Applications This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.
This device features two silicon pedestals embedded in a low loss glass.
The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by mak...


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