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THGBMHG7C1LBAIL

Toshiba
Part Number THGBMHG7C1LBAIL
Manufacturer Toshiba
Description 16GB density of e-MMC Module
Published Jan 28, 2019
Detailed Description THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Modul...
Datasheet PDF File THGBMHG7C1LBAIL PDF File

THGBMHG7C1LBAIL
THGBMHG7C1LBAIL

Overview
THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package.
This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.
1 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection P-WFBGA153-1113-0.
50 (11.
5mm x 13mm, H0.
8mm max.
package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC...


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