SML-E1/ENx Series ■Features • EXCELEDTM series • Compact, Thin size (1.6×0.8mm, t=0.36mm) LED die position is middle of package. • LED die consists of 4 elements • Original device technology enables high brightness and high reliability ■Outline Data Sheet ■Size 1608 (0603) 1.6×0.8mm (t=0.36m.
• EXCELEDTM series
• Compact, Thin size (1.6×0.8mm, t=0.36mm)
LED die position is middle of package.
• LED die consists of 4 elements
• Original device technology enables high brightness and high reliability
■Outline
Data Sheet
■Size
1608 (0603) 1.6×0.8mm (t=0.36mm)
Color Type
V
U
DY
M P E B WB
■Dimensions
0.8
1.6 1.2
Pattern R0.275 TH R0.15
Cathode index
+0.04 0.36 -0.1
■Recommended Solder Pattern
0.8
0.8 0.85
(0.13)
Electrode
0.8
PCB Bonding Direction
0.65
0.8 Tolerance : ±0.1
(unit : mm)
■Specifications
Absolute Maximum Ratings (Ta=25ºC)
Electrical and Optical Character.
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