MMSZ5255B Datasheet

MMSZ5255B Surface mount zener diode

MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package. Packing & Order.

Features

• Planar die construction.
• 500mW power dissipation.
• General purpose, medium current.
• Ideally suited for automated assembly processes.
• RoHS compliant package Applications
• Zener diode.
• Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATING @ Ta=25°C unless otherwise specified Symbol Parameter Value VF Forward Voltage @ IF=10mA 0.9 PD RθJA Power Dissipation Thermal resistance,junction to ambient air 500 350 TJ Junction Temperature 150 Tstg Storage Temperature Range -65 to +15.