Features Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Notes 3 & 4) Qualified to AEC-Q101 Standards for Hi.
Planar Die Construction
500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability
BZT52C2V0 - BZT52C51
SURFACE MOUNT ZENER DIODE
Mechanical Data
Case: SOD123
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderab.
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