• Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above
MECHANICAL DATA
• Case: Molded glass DO-35 • ...
BZX55-C2V7 PDF File
