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HFU2N70S

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N-Channel MOSFET


HFU2N70S
HFU2N70S

PDF File HFU2N70S PDF File


Description
HFD2N70S_HFU2N70S Dec 2009 HFD2N70S / HFU2N70S 700V N-Channel MOSFET BVDSS = 700 V RDS(on) typ = 5.
0 ȍ ID = 1.
5 A FEATURES ‰ Originative New Design ‰ Superior Avalanche Rugged Technology ‰ Robust Gate Oxide Technology ‰ Very Low Intrinsic Capacitances ‰ Excellent Switching Characteristics ‰ Unrivalled Gate Charge : 6.
2 nC (Typ.
) ‰ Extended Safe Operating Area ‰ Lower RDS(ON) : 5.
0 ȍ (Typ.
) @VGS=10V ‰ 100% Avalanche Tested D-PAK I-PAK 2 1 3 HFD2N70S 1 2 3 HFU2N70S 1.
Gate 2.
Drain 3.
Source Absolute Maximum Ratings TC=25୅ unless otherwise specified Symbol Parameter Value VDSS ID IDM VGS EAS IAR EAR dv/dt Drain-Source Voltage Drain Current Drain Current Drain Current – Continuous (TC = 25ഒ) – Continuous (TC = 100ഒ͚ – Pulsed (Note 1) Gate-Source Voltage Single Pulsed Avalanche Energy (Note 2) Avalanche Current (Note 1) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) 700 1.
5 0.
9 6.
0 ρ30 62 1.
5 3.
8 4.
5 PD TJ, TSTG TL Power Dissipation (TA = 25ఁ) * Power Dissipation (TC = 25ഒ͚ - Derate above 25ഒ Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds 2.
5 38 0.
3 -55 to +150 300 Units 9 $ $ $ 9 P$ P- 9QV : : :ഒ ഒ ഒ Thermal Resistance Characteristics Symbol RșJC RșJA RșJA Junction-to-Case Parameter Junction-to-Ambient* Junction-to-Ambient * When mounted on the minimum pad size recommended (PCB Mount) Typ.
---- Max.
3.
3 50 110 Units ഒ: క ΄Ͷ;ͺ͹΀Έ͑΃Ͷ·͟Ͳ͡͝͵ΖΔ͑ͣͪ͡͡ HFD2N70S_HFU2N70S Electrical Characteristics TC=25 qC unless otherwise specified Symbol Parameter Test Conditions Min On Characteristics VGS RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance VDS = VGS, ID = 250 ᒺ VGS = 10 V, ID = 0.
75 A 2.
0 -- Off Characteristics BVDSS ԩBVDSS /ԩTJ IDSS IGSSF IGSSR Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current,...



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