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SiA400EDJ

Vishay

N-Channel 30 V (D-S) MOSFET


SiA400EDJ
SiA400EDJ

PDF File SiA400EDJ PDF File


Description
SiA400EDJ Vishay Siliconix N-Channel 30 V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) 30 RDS(on) () 0.
019 at VGS = 4.
5 V 0.
025 at VGS = 2.
5 V ID (A)a 12 11.
6 12 Qg (Typ.
) PowerPAK SC-70-6L-Single • TrenchFET® Power MOSFET • New Thermally Enhanced PowerPAK® SC-70 Package - Small Footprint Area • Typical ESD Performance 2500 V HBM • 100 % Rg and UIS Tested • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 APPLICATIONS • Load Switch, OVP Switch • Boost Converters • DC/DC Converters D Marking Code 2.
05 mm 2.
05 mm Part # code AIX XXX Lot Traceability and Date code S N-Channel MOSFET G Ordering Information: SiA400EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current (t = 300 µs) Continuous Source-Drain Diode Current Avalanche Current Single Pulse Avalanche TC = 25 °C TA = 25 °C L = 0.
1 mH TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Symbol VDS VGS ID IDM IS IAS EAS PD TJ, Tstg Limit 30 ± 12 12a 12a 11b, c 8.
8b, c 30 12a 2.
9b, c 15 11.
25 19.
2 12.
3 3.
5b, c 2.
2b, c - 55 to 150 260 Unit V A mJ W TC = 25 °C TC = 70 °C Maximum Power Dissipation TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e °C THERMAL RESISTANCE RATINGS Symbol Typical Maximum Unit RthJA t5s 28 36 Maximum Junction-to-Ambientb, f °C/W RthJC 5.
3 6.
5 Maximum Junction-to-Case (Drain) Steady State Notes: a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SC-70 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework c...



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