Plastic Encapsulate ESD Protection Diodes
Description
Elektronische Bauelemente
SNESD05C
Plastic Encapsulate ESD Protection Diodes
RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
Designed to protect voltage sensitive electronic components from ESD and other transients.
Excellent clamping capability, low leakage, low capacitance, and fast response time provide best in class protection on designs that are exposed to ESD.
The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, Display Port TM, and MDDI interfaces.
It is designed to replace multiplayer varistors (MLV) in consumer equipments applications such as mobile phone, notebook, PAD, STB, LCD TV etc.
FEATURES
Bi-directional ESD Protection of One Line Low Capacitance: 10pF(Typ.
) Low Reverse Stand−off Voltage: 5V Low Reverse Clamping Voltage Low Leakage Current Fast Response Time
DFN0201
REF.
A B C D
Millimeter
Min.
Max.
0.
56 0.
67 0.
27 0.
37 0.
27 0.
34
0.
05 REF.
REF.
E F G H
Millimeter
Min.
Max.
0.
36 0.
44 0.
22 0.
30 0.
12 0.
20
0.
03 REF.
MARKING
PACKAGE INFORMATION
Package
MPQ
DFN0201
10K
Leader Size 7 inch
MAXIMUM RATINGS (TA=25°C)
Parameter
Symbol
Air
Electrostatic Discharge Voltage( IEC61000−4−2)1
Contact Per Human Body Model
VESD
Per Machine Model
Peak Pulse Power (8/20μs Waveform) 2
PPP
Lead Solder Temperature – Maximum (10 Second Duration) Peak Pulse Current (8/20μs Waveform) 2
TL IPP
Junction and Storage Temperature Range
TJ, TSTG
Notes: 1.
Device stressed with ten non-repetitive ESD pulses.
2.
Non-repetitive current pulse 8/20us exponential decay waveform according to IEC61000-4-5.
Rating
±25 ±25 ±16 400 50 260
5 150, -55~150
Unit
KV
KV V W °C A °C
http://www.
SeCoSGmbH.
com/
30-Dec-2016 Rev.
D
Any changes of specification will not be informed individually.
Page 1 of 3
Elektronische Bauelemente
ELECTRICAL PARAMETER
SNESD05C
Plastic Encapsulate ESD Protection Diodes
ELECTRICAL CHARACTERISTICS (TA=25°C u...
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