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2547

AllegroMicroSystems

PROTECTEDQUADPOWERDRIVERS


2547
2547

PDF File 2547 PDF File


Description
2547 PROTECTED QUAD POWER DRIVERS 2547 PROTECTED QUAD POWER DRIVERS Providing interface between low-level logic and power loads, the UDK/UDN/UDQ2547B and UDK/UDN/UDQ2547EB quad power drivers combine logic gates and high-current bipolar outputs with complete output protection.
Each of the four outputs will sink 600 mA in the ON state.
The outputs have a minimum breakdown voltage (load dump) of 60 V and a sustaining voltage of 40 V.
The inputs are compatible with TTL and 5 V CMOS logic systems and include internal pull-down resistors to ensure that the outputs remain OFF if the inputs are open-circuited.
Over-current protection for each channel has been designed into these devices and is activated at approximately 1.
3 A.
It protects each output from short circuits with supply voltages up to 25 V.
When a maximum driver output current is reached, that output drive is reduced linearly, maintaining a constant load current.
If the over-current or short circuit condition continues, each channel has an independent thermal limit circuit which will sense the rise in junction temperature and turn OFF the individual channel that is at fault.
Foldback circuitry decreases the output current if excessive voltage is present across the output and assists in keeping the device within its SOA (safe operating area).
Each output also includes diagnostics for increased device protection.
If any output is shorted or opened, the diagnostics can signal the controlling circuitry through a common FAULT pin.
These devices can be used to drive various resistive loads including incandescent lamps (without warming or limiting resistors).
With the addition of external output clamp diodes, they can be used to drive inductive loads such as relays, solenoids, or dc stepping motors.
The suffix ‘B’ devices are 16-pin power DIPs while the suffix ‘EB’ devices are 28-lead power PLCCs for surface-mount applications.
Both packages are of batwing construction to provide for maximum package power dissipation.
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