Outgassing Compliant Chip Inductors
Description
0402 CHIP INDUCTORS
OutgassingCompliantChipInductors AE235RAA
■ Exceptionally high Q factors ■ Outstanding self-resonant frequency ■ Tight inductance tolerance ■ High temperature materials allow operation in ambient temperatures up to 155°C.
■ Passes NASA low outgassing specifications ■ Leach-resistant base metalization with tin-lead (Sn-Pb) terminations ensures the best possible board adhesion
Current Derating
120 110 100
Percent of rated Irms
90 80 70 60 50
Typical L vs Frequency
30 27 nH 25
30 20 10 0 -55 -40
Inductance (nH)
20
19 nH
-20
0
20
25°C
40
40
60
80
100
120
140 160
Ambient temperature (°C)
B overall C D
I
15 12 nH 10 5.
6 nH
H
F
5 0 1 10 100 1000 10000
A
1 nH
G F
J
I
Frequency (MHz)
Typical Q vs Frequency
120 110 100 90 80 12 nH 5.
6 nH 19 nH 27 nH 1 nH
E terminal
Terminal wraparound: approx 0.
007/0,18 both ends
Suggested Land Pattern
A B C D max max max ref E F G H I J 0.
047 0.
025 0.
026 0.
010 0.
020 0.
009 0.
022 0.
026 0.
014 0.
018 1,19 0,64 0,66 0,25 0,51 0,23 0,56 0,66 0,36 0,46
Note: Dimensions are before solder application.
For maximum overall dimensions including solder, add 0.
0025 in / 0,064 mm to B and 0.
006 in / 0,15 mm to A and C.
Q Factor
70 60 50 40 30 20 10 0 1 10 100 1000 10000
Core material Ceramic Terminations Tin-lead (63/37) over silver-platinum-glass frit Ambient temperature –55°C to +125°C with Imax current, +125°C to +155°C with derated current Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 2000 per 7″ reel Paper tape: 8 mm wide, 0.
68 mm thick, 2 mm pocket spacing
®
Frequency (MHz)
These parts are preproduction products for electrical evalu...
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