ULTRA HIGH DENSITY OPEN PIN FIELD
Description
F-212-1
SEAF8–30–05.
0–S–06–2–K–TR
(0,80 mm) .
0315" SEAF8 SERIES
SEAF8–30–05.
0–S–04–2–K–TR
ULTRA HIGH DENSITY OPEN PIN FIELD
SPECIFICATIONS
For complete specifications and recommended PCB layouts see www.
samtec.
com?SEAF8 Insulator Material: Black LCP Contact Material: Copper Alloy Operating Temp Range: -55°C to +125°C Plating: Au or Sn over 50µ" (1,27 µm) Ni Working Voltage: 220 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes
Mates with: SEAM8
Signal Integrity optimized Edge Rate™ contact Up to 180 I/Os
™
4 and 6 row
ALSO AVAILABLE
• Other pin counts in design.
Call Samtec.
Lead-Free Solder Charge Terminations
7 mm and 10 mm Stack Heights
www.
DataSheet.
net/
SEAF8
NO.
PINS PER ROW
05.
0
PLATING OPTION
NO.
OF ROWS
SOLDER TYPE
K
TR
– TR
–S –10, – 20, – 30
(Call Samtec for other sizes) = 30µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail
– 04
=Four Rows
–2
= Lead-Free Tin Alloy 95.
5% Sn/3.
8% Ag/0.
7%Cu Solder Charge
–K
= Polyimide film Pick & Place Pad
=Tape & Reel
– 06
=Six Rows
No.
of positions x (0,80) .
0315 + (5,84) .
230
06
NO.
OF ROWS –04
A
(4,30) .
169 (6,30) .
248
MATED HEIGHT*
SEAF8 LEAD STYLE SEAM8 LEAD STYLE
(0,75) .
029
01
A
–S02.
0
(7,00) .
276
–S05.
0
(10,00) .
394
–06
–05.
0
*Processing conditions will affect mated height.
(1,27) .
050 (1,10) (1,32) (1,32) .
043 x .
052 .
052 DIA No.
of positions x (0,80) .
0315 + (2,56) .
101
(4,70) .
185
(2,87) .
113 (0,80) .
0315
Note: Some sizes, styles and options are non-standard, non-returnable.
WWW.
SAMTEC.
COM
Datasheet pdf - http://www.
DataSheet4U.
co.
kr/
...
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