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CP353V

Central Semiconductor

Small Signal Transistors NPN - High Current Transistor Chip


Description
PROCESS Small Signal Transistors CP353V NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter 1 Bonding Pad Area Emitter 2 Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 3,878 PRINCIPAL DEVICE TYPES CZT853 EPITAXIAL PLANAR 66 x 66 MILS 7.1 MILS 7....



Central Semiconductor

CP353V

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