Small Signal Transistor NPN - Silicon Darlington Transistor Chip
Description
PROCESS
Small Signal Transistor
CP327V
NPN - Silicon Darlington Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 33,085 PRINCIPAL DEVICE TYPES CMLT6427E CMST6427E EPITAXIAL PLANAR 23 x 23 MILS 7.1 MILS 4.7 x 4.7 MI...
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