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CP318V

Central Semiconductor

Small Signal Transistor NPN - High Voltage Transistor Chip


Description
PROCESS Small Signal Transistor CP318V NPN - High Voltage Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 25,536 PRINCIPAL DEVICE TYPES MPS455 EPITAXIAL PLANAR 26 x 26 MILS 7.1 MILS ± 0.6 MILS 5.5 x 5.5 MILS 5.5 x...



Central Semiconductor

CP318V

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