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CP316V

Central Semiconductor

Small Signal Transistors NPN - High Voltage Transistor Chip


Description
PROCESS Small Signal Transistors CP316V NPN - High Voltage Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 57,735 PRINCIPAL DEVICE TYPES CMPT5551 CXT5551 CZT5551 2N5551 EPITAXIAL PLANAR 20 x 20 MILS 7.1 MILS 4.0 x...



Central Semiconductor

CP316V

PDF File CP316V PDF File


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