Small Signal Transistor NPN - Silicon Darlington Transistor Chip
Description
PROCESS
Small Signal Transistor
CP307
NPN - Silicon Darlington Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 15,165 PRINCIPAL DEVICE TYPES 2N6426 2N6427 CMPT6427 CMPTA13 CMPTA14 CXTA14 CZTA14 MPSA13 MPSA14 MPSA2...