225W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
Description
DFLT5V0A - DFLT51A
225W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR PowerDI ä123 Features
NEW PRODUCT
· · · · · · · · · · · · · ·
225W Peak Pulse Power Dissipation (10ms x 1000ms waveform) 5.
0V - 51V Standoff Voltages Excellent Clamping Capability Lead Free Finish, RoHS Compliant (Note 6) "Green" Molding Compound (No Br, Sb) Qualified to AEC-Q101 Standards for High Reliability
B A D H
PowerDIä123 Dim A B C D
C E
Min 3.
50 2.
60 1.
63 0.
93 0.
85 0.
15 0.
45 — — — 0.
90
Max 3.
90 3.
00 1.
93 1.
00 1.
25 0.
25 0.
85 — — — 1.
30
Typ 3.
70 2.
80 1.
78 0.
98 1.
00 0.
20 0.
65 1.
35 1.
10 0.
20 1.
05
Mechanical Data
Case: PowerDIä123 Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: Cathode Band Terminals: Finish ¾ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208 e3 Marking & Type Code Information: See Last Page Ordering Information: See Last Page Weight: 0.
01 grams (approximate) @ TA = 25°C unless otherwise specified Symbol PPK IFSM VF Tj TSTG Value 225 1125 50 3.
5 -65 to +150 -65 to +150
E L4 A L2 L3
E H L
L
L1
L1 L2 L3 L4
All Dimensions in mm
Maximum Ratings
Characteristic Peak Pulse Power Dissipation (Note 1) 10/1000ms (Note 2) 8/20ms Peak Forward Surge Current, 8.
3ms Single Half Sine Wave Instantaneous Forward Voltage (Note 5) www.
DataSheet4U.
com Operating Temperature Range Storage Temperature Range @ IPP = 12A
Unit W A V °C °C
Thermal Characteristics
@ TA = 25°C unless otherwise specified Symbol PD RqJA RqJS Value 1.
0 125 6 Unit W °C/W °C/W
Characteristic DC Steady-State Power Dissipation (Note 3) Thermal Resistance, Junction to Ambient (Note 3) Thermal Resistance, Junction to Soldering Point (Note 4)
Notes: 1.
2.
3.
4.
5.
6.
Non-Repetitive current pulse as shown in figure 3 and derated above T A = 25°C as per figure 1.
Non-Repetitive current pulse as shown in figure 5 and derated above TA = 25°C as per figure 1.
Device mounte...
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