Silicon N Channel Power MOS FET Power Switching
Description
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RJK0301DPB
Silicon N Channel Power MOS FET Power Switching
REJ03G1338-0900 Rev.
9.
00 Apr 19, 2006
Features
• • • • • High speed switching Capable of 4.
5V gate drive Low drive current High density mounting Low on-resistance RDS(on) = 2.
3 mΩ typ.
(at VGS = 10 V)
Outline
RENESAS Package code: PTZZ0005DA-A (Package name: LFPAK)
5 D 5 4 G 3 12 4 1, 2, 3 4 5 Source Gate Drain
S S S 1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel to Case Thermal Resistance Channel temperature Storage temperature Notes: 1.
PW ≤ 10 µs, duty cycle ≤ 1% 2.
Value at Tch = 25°C, Rg ≥ 50 Ω 3.
Tc = 25°C Symbol VDSS VGSS ID ID(pulse) IDR IAP Note 2 EAR Note 2 Pch Note3 θch-C Tch Tstg
Note1
Ratings 30 +16/ –12 60 240 60 30 90 65 1.
93 150 –55 to +150
Unit V V A A A A mJ W °C/W °C °C
Rev.
9.
00 Apr 19, 2006 page 1 of 6
RJK0301DPB
Electrical Characteristics
(Ta = 25°C)
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Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Gate Resistance Total gate charge Gate to source charge Gate to drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Notes: 4.
Pulse test
Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDF trr
Min 30 — — 1.
2 — — — — — — — — — — — — — — — —
Typ — — — — 2.
3 3.
0 110 5000 1450 220 0.
8 32 14.
5 7.
0 11.
5 4.
5 58 6.
0 0.
84 50
Max — ±0.
1 1 2.
5 2.
8 4.
0 — — — — — — — — — — — — 1.
10 —
Unit V µA µA V mΩ mΩ S pF pF pF Ω nC nC nC ns ns ns ns V ns
Test Conditions ID = 10 mA, VGS = 0 VGS = +16/–12 V, VDS = 0 VDS = 3...
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