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IHLP2525CZER1R0M01

Vishay Siliconix

High Current Inductor


IHLP2525CZER1R0M01
IHLP2525CZER1R0M01

PDF File IHLP2525CZER1R0M01 PDF File


Description
www.
DataSheet4U.
com IHLP-2525CZ-01 Vishay Dale Low Profile, High Current Inductor FEATURES • Lowest height (3.
0mm) in this package footprint.
• Shielded construction.
• Frequency range up to 5.
0MHz.
• Lowest DCR/µH, in this package size.
Manufactured under one or more of the following: US Patents; 6,198,375 / 6,204,744 / 6,449,829 / 6,460,244.
Several foreign patents, and other patents pending.
STANDARD ELECTRICAL SPECIFICATIONS Lo DCR mΩ DCR mΩ HEAT RATING INDUCTANCE TYPICAL MAX CURRENT µH ± 20% 25°C 25°C DC AMPS3 @100KHz, .
25V, 0A TYPICAL 0.
10 1.
5 1.
7 32.
5 0.
15 1.
9 2.
5 26 0.
20 2.
4 3.
0 24 0.
22 2.
5 2.
8 23 0.
33 3.
5 3.
9 20 0.
47 4 4.
2 17.
5 0.
68 5 5.
5 15.
5 0.
82 6.
7 8 13 1.
0 9 10 11 1.
5 14 15 9 2.
2 18 20 8 3.
3 28 30 6 4.
7 37 40 5.
5 6.
8 54 60 4.
5 8.
2 64 68 4 10 102 105 3 SATURATION CURRENT DC AMPS4 TYPICAL 60 52 41 40 30 26 25 24 22 18 14 13.
5 10 8 7.
5 7.
0 • Handles high transient current spikes without saturation.
• Ultra low buzz noise, due to composite construction.
• 100% Lead (Pb)-free and RoHS compliant.
APPLICATIONS • PDA/Notebook/Desktop/Server applications.
• High current POL converters.
• Low profile, high current power supplies.
• Battery powered devices.
• DC/DC converters in distributed power systems.
• DC/DC converter for Field Programmable Gate Array (FPGA).
DIMENSIONS in inches [millimeters] Typical Pad Layout (Min.
) 0.
255 ± 0.
010 [6.
47 ± 0.
254] 0.
125 ±0.
01 [3.
18 ± 0.
3] 0.
135 [3.
43] 0.
146 [3.
71] 0.
290 [7.
37] 0.
270 ± 0.
015 [6.
86 ± 0.
381] NOTES: 1.
All test data is referenced to 25°C ambient.
2.
Operating Temperature Range - 55°C to + 125°C 3.
DC current (A) that will cause an approximate ∆T of 40°C.
4.
DC current (A) that will cause Lo to drop approximately 20% 5.
The part temperature (ambient + temp rise) should not exceed 125°C under worst case operating conditions.
Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature.
Part temperature should be verified in the end a...



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