Silicon PIN diode
Description
SOT323
BAP51-05W
Silicon PIN diode
Rev.
2.
1 — 8 February 2019
Product data sheet
1 Product profile
1.
1 General description
Two planar PIN diodes in common cathode configuration in a SOT323 small SMD plastic package.
1.
2 Features and benefits
• Two elements in common cathode configuration in a small SMD plastic package • Low diode capacitance • Low diode forward resistance • AEC-Q101 qualified
1.
3 Applications
• General RF applications
2 Pinning information
Table 1.
Discrete pinning Pin Description
1
anode (a1)
2
anode (a2)
3
common cathode
Simplified outline Graphic symbol
3
1
2
sot323_so
Top view
3 Ordering information
Table 2.
Ordering information Type number Package
Name Description
BAP51-05W -
plastic surface-mounted package; 3 leads
Version SOT323
NXP Semiconductors
BAP51-05W
Silicon PIN diode
4 Marking
Table 3.
Marking Type number
BAP51-05W
Marking code %1W
5 Limiting values
Table 4.
Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VR
continuous reverse
-
voltage
IF
continuous forward
-
current
Ptot
total power dissipation Tsp ≤ 90 °C
-
Tstg
storage temperature
-65
Tj
junction temperature
-65
6 Thermal characteristics
Table 5.
Thermal characteristics Symbol Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
Max
Unit
50
V
50
mA
240
mW
+150
°C
+150
°C
Typ Unit 250 K/W
BAP51-05W
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev.
2.
1 — 8 February 2019
© NXP B.
V.
2019.
All rights reserved.
2/9
NXP Semiconductors
BAP51-05W
Silicon PIN diode
7 Characteristics
Table 6.
Characteristics Tj = 25 °C unless otherwise specified.
Symbol Parameter
VF
forward voltage
VR
reverse voltage
IR
reverse current
Cd
diode capacitance
rD
diode forward resistance
τL
charge carrier life time
LS
series inductance
Conditions IF = 50 mA IR = 10 μA VR = 50 V f =...
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