Band-switching diode
Description
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
L8
M3D178
BA792 Band-switching diode
Product specification 1996 Mar 13
Philips Semiconductors
Product specification
Band-switching diode
FEATURES • Ceramic SMD package • Low diode capacitance: max.
1.
1 pF • Low diode forward resistance: max.
0.
7 Ω.
APPLICATIONS • Low loss band-switching in VHF television tuners • Surface mount high-speed switching circuits.
Marking code: L8.
bottom view side view top view
handbook, 4 columns
BA792
cathode mark k k a
a
MAM139
DESCRIPTION Planar, high performance band-switching diode in a small ceramic SOD110 SMD package.
Fig.
1 Simplified outline (SOD110) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VR IF Tstg Tj PARAMETER continuous reverse voltage continuous forward current storage temperature junction temperature − − −65 − MIN.
35 100 +150 150 MAX.
V mA °C °C UNIT
1996 Mar 13
2
Philips Semiconductors
Product specification
Band-switching diode
ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified.
SYMBOL VF IR Cd rD Note 1.
Guaranteed on AQL basis: inspection level S4, AQL 1.
0.
THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1.
Device mounted on a printed-circuit board measuring 11 × 25 × 1.
6 mm.
MOUNTING Reflow soldering Follow standard reflow soldering techniques to ensure correct application of solder paste and placement of the SOD110 package (see Fig.
2).
Wave soldering PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 315 PARAMETER forward voltage reverse current diode capacitance diode forward resistance IF = 100 mA VR = 20 V VR = 20 V; Tamb = 75 °C VR = 3 V; f = 1 to 100 MHz; note 1 IF = 3 mA; f = 200 MHz; note 1 CONDITIONS 10 1 1.
1 0.
7 MAX.
1.
1
BA792
UNIT V nA µA pF Ω
UNIT K/W
Before wave soldering, attach SOD110 packages to the printed-circuit boards using a small dot of thermo-setting epoxy or UV-curing adhesive centred between the soldering lands (see Fig.
3).
handbook...
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