2k8 bit electrically erasable PROM
Description
Memory ICs
BR24L16-W / BR24L16F-W / BR24L16FJ-W / BR24L16FV-W / BR24L16FVM-W
2k×8 bit electrically erasable PROM
BR24L16-W / BR24L16F-W / BR24L16FJ-W BR24L16FV-W / BR24L16FVM-W
The BR24L16-W series is 2-wire (I2C BUS type) serial EEPROMs which are electrically programmable.
∗ I2C BUS is a registered trademark of Philips.
zApplications General purpose zFeatures 1) 2k registers × 8 bits serial architecture.
2) Single power supply (1.
8V to 5.
5V).
3) Two wire serial interface.
4) Self-timed write cycle with automatic erase.
5) 16 byte page write mode.
6) Low power consumption.
Write (5V) : 1.
2mA (Typ.
) Read (5V) : 0.
2mA (Typ.
) Standby (5V) : 0.
1µA (Typ.
) 7) DATA security Write protect feature (WP pin) .
Inhibit to WRITE at low VCC.
8) Small package - - - DIP8 / SOP8 / SOP-J8 / SSOP-B8 / MSOP-8 9) High reliability EEPROM with Double-Cell structure.
10) High reliability fine pattern CMOS technology.
11) Endurance : 1,000,000 erase / write cycles 12) Data retention : 40 years 13) Filtered inputs in SCL•SDA for noise suppression.
14) Initial data FFh in all address.
zAbsolute maximum ratings (Ta=25°C)
Parameter Supply voltage Symbol VCC Limits −0.
3 to +6.
5 800 (DIP8) 450 (SOP8) Power dissipation Pd 450 (SOP-J8)
∗1 ∗2 ∗3
Unit V
mW
300 (SSOP-B8) ∗4 310 (MSOP8) Storage temperature Operating temperature Terminal voltage
∗1 ∗2, 3 ∗4 ∗5
∗5
Tstg Topr −
−65 to +125 −40 to +85 −0.
3 to VCC+0.
3
°C °C
V
Degradation is done at 8.
0mW/°C for operation above 25°C.
Degradation is done at 4.
5mW/°C for operation above 25°C.
Degradation is done at 3.
0mW/°C for operation above 25°C.
Degradation is done at 3.
1mW/°C for operation above 25°C.
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Memory ICs
BR24L16-W / BR24L16F-W / BR24L16FJ-W / BR24L16FV-W / BR24L16FVM-W
Symbol VCC VIN Limits 1.
8 to 5.
5 0 to VCC Unit V V
zRecommended operating conditions
Parameter Supply voltage Input voltage
zDC operating characteristics (Unless otherwise specified Ta=−40 to 85°C, VCC=1.
8 to 5.
5V)
Parameter "HIGH" input volatge 1 "LOW" input vol...
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