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RHK003N06FRA

Rohm

Nch 60V 300mA Small Signal MOSFET


RHK003N06FRA
RHK003N06FRA

PDF File RHK003N06FRA PDF File


Description
RHK003N06FRA Nch 60V 300mA Small Signal MOSFET VDSS RDS(on)(Max.
) ID PD 60V 1.
0Ω ±300mA 200mW lFeatures 1) Very fast switching 2) Pb-free lead plating ; RoHS compliant.
3) AEC-Q101 Qualified lOutline SOT-346 SC-59 SMT3 lInner circuit Datasheet AEC-Q101 Qualified lApplication Switching circuits lPackaging specifications Packing Reel size (mm) Type Tape width (mm) Quantity (pcs) Taping code Marking lAbsolute maximum ratings (Ta = 25°C ,unless otherwise specified) Parameter Symbol Value Drain - Source voltage Continuous drain current Pulsed drain current Gate - Source voltage Power dissipation Junction temperature Operating junction and storage temperature range VDSS ID IDP*1 VGSS PD*2 Tj Tstg 60 ±300 ±1.
2 ±20 200 150 -55 to +150 Embossed Tape 180 8 3000 T146 RKS Unit V mA A V mW ℃ ℃ www.
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com © 2022 ROHM Co.
, Ltd.
All rights reserved.
1/10 20221214 - Rev.
002 RHK003N06FRA lThermal resistance Parameter Thermal resistance, junction - ambient Datasheet Symbol RthJA*2 Values Unit Min.
Typ.
Max.
- - 625 ℃/W lElectrical characteristics (Ta = 25°C) Parameter Symbol Conditions Drain - Source breakdown voltage V(BR)DSS VGS = 0V, ID = 1mA Breakdown voltage temperature coefficient ΔV(BR)DSS  ID = 1mA ΔTj referenced to 25℃ Zero gate voltage drain current IDSS VDS = 60V, VGS = 0V Gate - Source leakage current IGSS VGS = ±20V, VDS = 0V Gate threshold voltage Gate threshold voltage temperature coefficient VGS(th) ΔVGS(th) ΔTj VDS = 10V, ID = 1mA ID = 1mA referenced to 25℃ Static drain - source on - state resistance RDS(on)*3 VGS = 10V, ID = 300mA VGS = 4V, ID = 300mA Forward Transfer Admittance |Yfs|*3 VDS = 10V, ID = 300mA Values Unit Min.
Typ.
Max.
60 - - V - 66.
1 - mV/℃ - - 1 μA - - ±10 μA 1.
0 - 2.
5 V - -3.
0 - mV/℃ - 0.
7 1.
0 Ω - 1.
1 1.
5 200 - - mS *1 Pw≦10μs , Duty cycle≦1% *2 Each terminal mounted on a reference land.
*3 Pulsed www.
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com © 2022 ROHM Co.
, Ltd.
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2/10 20221214 - Rev.
002 RHK...



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