MASW-008902-000DIE

MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Features 802.11b/g and Bluetooth Applications Insertion Loss: 0.60 dB typical Isolation: 31 dB typical (RX Path) 22 dB typical (TX / BT paths) Flip-chip configuration RoHS* Compliant Description The MASW-008902-000DIE is a bumped single band GaAs pHEMT MMIC SP3T switch. Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications. The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. The MASW-008902-000DIE is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for WLCSP applications. Ordering Information 1,2 Part Number Package MASW-008902-000DIE Separated Die on Grip Ring Rev. V4 Die Bump Pad Layout (bump side up) Die Bump Pad Configuration Name Description VC1 BT GND Voltage Control 1 Blue Tooth TX/RX Port Ground TX VC3 RX VC2 RFC 2.5 GHz TX Port Voltage Control 3 2.5 GHz RX Port Voltage Control 2 Antenna Port MASW-008902-000D3K Die in 3000 piece reel MASW-008902-001SMB Sample Board SP3T 1. Die quantity varies. 2. Die on Grip Ring not available with orientation mark. Absolute Maximum Ratings 3,4 Parameter Input Power @ 3 V Control Input Power @ 5 V Control Operating Voltage Operating Temperature Storage Temperature Absolute Maximum +32 dBm +35 dBm +8 volts -40°C to +85°C -65°...