Document
CREAT BY ART
Surface Mount Fast Recovery Rectifiers
RS1AL thru RS1ML
Taiwan Semiconductor
FEATURES
- Glass passivated junction chip - Ideal for automated placement - Fast switching for high efficiency - Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: Sub SMA Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately)
Sub SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
RS1 RS1 RS1 RS1 RS1 RS1 SYMBOL
AL BL DL GL JL KL
Marking code
RAL RBL RDL RGL RJL RKL
Maximum repetitive peak reverse voltage
VRRM
50 100 200 400 600 800
Maximum RMS voltage
VRMS
35 70 140 280 420 560
Maximum DC blocking voltage
VDC 50 100 200 400 600 800
Maximum average forward rectified current
IF(AV)
0.8
Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load
IFSM
30
RS1 ML RML 1000 700 1000
Maximum instantaneous forward voltage (Note 1) @ 0.8 A
VF
1.3
Maximum reverse current @ rated VR TJ=25 ℃ TJ=125 ℃
IR
Typical junction capacitance (Note 2)
Cj
Maximum reverse recovery time (Note 3)
Trr
Typical thermal resistance
RθjL RθjA
Operating junction temperature range Storage temperature range Note 1: Pulse test with PW=300μs, 1% duty cycle
TJ TSTG
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
5 50 10 150 250
32 105
- 55 to +150 - 55 to +150
500
UNIT
V V V A A
V
μA pF ns OC/W OC OC
Document Number: DS_D1405034
Version: K14
RS1AL thru RS1ML
Taiwan Semiconductor
ORDERING INFORMATION
PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND
QUALIFIED
RS1xL (Note 1)
Prefix "H"
RU RV RT MT RQ MQ R3 RF R2 M2 RH
CODE Suffix "G"
MH
Note 1: "x" defines voltage from 50V (RS1AL) to 1000V (RS1ML)
PACKAGE
Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA
PACKING
1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) 10,000 / 13" Paper reel (12mm tape) 10,000 / 13" Plastic reel (12mm tape)
EXAMPLE
PREFERRED P/N PART NO.
RS1ML RU RS1ML RUG RS1MLHRU
RS1ML RS1ML RS1ML
AEC-Q101 QUALIFIED
H
PACKING CODE
RU RU RU
GREEN COMPOUND CODE
G
DESCRIPTION
Green compound AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
AVERAGE FORWARD A CURRENT (A)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1
0 0
FIG.1 FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTIVE LOAD
25 50 75 100 125 150 175 LEAD TEMPERATURE (oC)
50 40 30 20 10
0 1
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
8.3ms Single Half Sine Wave
10 NUMBER OF CYCLES AT 60 Hz
100
PEAK FORWARD SURGE CURRENT (A)
Document Number: DS_D1405034
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS 100
10 TJ=125℃
1 0.1 TJ=100℃
0.01
TJ=25℃
0.001 0
20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS 10
Pulse Width=300μs 1% Duty Cycle
TJ=125℃ 1
TJ=25℃
0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V)
Version: K14
FIG. 5 TYPICAL JUNCTION CAPACITANCE 100
f=1.0MHz Vsig=50mVp-p
10
CAPACITANCE (pF)
1 1 10 REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
100
RS1AL thru RS1ML
Taiwan Semiconductor
DIM.
B C D E F G H I J
Unit (mm)
Min Max 1.70 1.90 2.70 2.90 0.16 0.30 1.23 1.43 0.80 1.20 3.40 3.80 2.45 2.60 0.35 0.85 0.00 0.10
Unit (inch)
Min Max 0.067 0.075 0.106 0.114 0.006 0.012 0.048 0.056 0.031 0.047 0.134 0.150 0.096 0.102 0.014 0.033 0.000 0.004
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
P/N G YW F
= Marking Code = Green Compound = Date Code = Factory Code
Symbol A B C D E
Document Number: DS_D1405034
Unit (mm) 1.4 1.2 3.1 1.9 4.3
Unit (inch) 0.055 0.047 0.122 0.075 0.169
Version: K14
CREAT BY ART
RS1AL thru RS1ML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as pro.