plerowTM ALN0839AT
Internally Matched LNA Module
C o u pl er
C o u pl er
Features
· S21 = 20.2 dB @ 824 MHz = 19.8 dB @ 849 MHz
· NF of 0.60 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level.
Specifications (in Production)
Typ. @ T = 25C, Vs = 5 V, Freq. =836.5 MHz, Zo.sys = 50 ohm
Parameter
Frequency Range Gain Gain Flatness Noise Figure Output IP3 (1) S11 / S22 (2) Output P1dB Switching Time (3) Supply Current Supply Voltage Impedance Max. RF Input Power Package Type & Size
Unit
MHz dB dB dB dBm dB dBm sec mA V dBm mm
Specifications
Min Typ Max
824 849
19 20
0.2
0.3
0.60 0.65
27 28
-15 / -12
14 15
40 60 5 50 C.W 29 ~ 31 (before fail) Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of +0 dBm / tone separated by 1 MHz. 2) S11, S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
1-stage Single Type
More Information
Website: www.asb.co.kr E-mail:
[email protected] Tel: (82) 42-528-7223 Fax: (82) 42-528-7222
Outline Drawing (Unit: mm)
plerow ALN0839AT ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
(Side View)
Pin Number 2 5 6
Others
Function RF In RF Out Vs Ground
Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations.
2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
May 2010
Typical Performance (Measured)
824~849 MHz +5 V
S-parameters & K Factor
plerowTM ALN0839AT
Internally Matched LNA Module S-parameters
Noise Figure
OIP3
P1dB
2/3
www.asb.co.kr
May 2010
Application Circuit
C1 IN
plerowTM ALN0839AT
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic) Capacitor
C2
ALN
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
260C
20~40 sec
Evaluation Board Layout
Vs
Ramp-up (3˚C/sec)
200C
Ramp-down (6C/sec)
IN
OUT
150C 60~180 sec
Size 25x25mm (for ALN-AT, BT, T Series – 10x10mm)
3/3
www.asb.co.kr
May 2010
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