MMSZ5263B

NEW PRODUCT Features Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Note 4) Qualified to AEC-Q101 Standards for High Reliability MMSZ5263B 500mW SURFACE MOUNT ZENER DIODE Mechanical Data Case: SOD-123 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.01 grams (approximate) Top View Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Forward Voltage (Note 3) @ IF = 10mA Symbol VF Value 0.9 Unit V Thermal Characteristics Characteristic Power Dissipation (Note 1) @TL = 75°C Thermal Resistance, Junction to Ambient Air (Note 1) Thermal Resistance, Junction to Lead (Note 2) Operating and Storage Temperature Range Symbol PD RθJA RθJL TJ, TSTG Value 500 350 150 -65 to +150 Unit mW °C/W °C/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Type Number MMSZ5263B Type Code M8 Zener Voltage Range (Note 3) Nom (V) 56 VZ @ IZT Min (V) 53.20 Max (V) 58.80 Test Current IZT mA 2.2 Maximum Zener Impedance (Note 5) ZZT @ IZT ZZK @ IZK = 0.25mA Ω 150 1300...