Document
Small Signal Product
TSS0230LU
Taiwan Semiconductor
Surface Mount Schottky Barrier Diode
FEATURES
- Designed for mounting on small surface - Extremely thin/leadless package - Low capacitance - Low forward voltage drop - Packing code with suffix "G" means
green compound (halogen-free)
MECHANICAL DATA
- Case: 0603-B - Terminal: Gold plated, solderable per
MIL-STD-750, method 2026 - Polarity : Indicated by cathode band - Weight : 0.003 g (approximately) - Marking code: BA
0603-B
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
Repetitive Peak Reverse Voltage
VRRM
35
DC Reverse Voltage
VR 30
Average Forward Current
IO 200
Peak Forward Surge Current 8.3 ms Single Half Sine-Wave Superimposed on Rate Load
IFSM
1.0
Power Dissipation Forward Voltage @ IF=200mA Reverse Leakage Current Junction Temperature Storage Temperature
VR=10V
Pd VF IR TJ TSTG
150 0.5 30 -40 to +125 -40 to +125
UNIT V V mA
A
mW V μA oC oC
Document Number: DS_S1412031
Version: B14
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Forward current (mA)
1000
Fig.1 Forward Characteristics
100
10 125゚C 75゚C
1 25゚C -25゚C
0.1 0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Forward Voltage(V)
Fig. 3 Capacitance Between Terminals Characteristics 100
f = 1MHz
10
Capacitance Between Terminals (pF)
1 0 5 10 15 20 25 30
Reverse Voltage (V)
Average Forward Current (mA)
Reverse Current (A)
TSS0230LU
Taiwan Semiconductor
1000 100 10 1 0.1 0.01
0.001 0
Fig. 2 Reverse Characteristics
75゚C 25゚C
-25゚C
0.2 0.4 0.6 0.8 Reverse voltage (V)
1
1.2
120 100
80 60 40 20
0 0
Fig. 4 Current Derating Rate
25 50 75 100 125 150 Ambient Temperature (゚C)
Forward Voltage(mV)
FIg. 5 VF Dispersion Map
450
440
Tm=25゚C F=200 mA
430 n=30pcs
420
410 AVG 21 28mV
400 0 10 20 30 40 50 60 70 80 90 100
FIg. 6 IR Dispersion
50
45 Tm=25゚C
40 35 30
VR=10V n=30pcs
25
20
15 10
AVG1816uA
5
0
0 10 20 30 40 50 60 70 80 90 100
Reverse oumont(nA) Capacitance between
Terminals(pF)
FIg. 7 CT Dispersion Map
30
29 Tm=25゚C
28 F=1MHz
27 VR=0V
26 25
n=10pcs
24
23
22 21 AVG22.8pF
20
0 10 20 30 40 50 60 70 80 90 100
Document Number: DS_S1412031
Version: B14
Small Signal Product
ORDERING INFORMATION
PART NO.
PART NO. SUFFIX (Note 1)
PACKING CODE
PACKING CODE SUFFIX
TSS0230LU
-xx
R4
G
Note 1: Part No. Suffix „-xx “ would be used for special requirement
TSS0230LU
Taiwan Semiconductor
PACKAGE 0603-B
PACKING 4K / 7" Reel
EXAMPLE
PREFERRED P/N
PART NO.
TSS0230LU R4G TSS0230LU
PART NO. SUFFIX
TSS0230LU-F0 R4G TSS0230LU
-F0
PACKAGE OUTLINE DIMENSION 0603-B
PACKING CODE R4 R4
PACKING CODE SUFFIX G
G
DESCRIPTION
Multiple manufacture source
Green compound
Defined manufacture source
Green compound
DIM.
L W T C D E
Unit (mm)
Min Typ. Max 1.60 - 1.80 0.80 - 1.00 0.70 - 0.85
- 0.35 - 0.70 - 0.30 -
Min 0.063 0.031 0.028
-
Unit (inch)
Typ. -
0.014 0.028 0.012
Max 0.071 0.039 0.033
-
Document Number: DS_S1412031
Version: B14
Small Signal Product
TSS0230LU
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1412031
Version: B14
.