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MADP-011034-10720T Dataheets PDF



Part Number MADP-011034-10720T
Manufacturers MA-COM
Logo MA-COM
Description Non-Magnetic MELF PIN Diode
Datasheet MADP-011034-10720T DatasheetMADP-011034-10720T Datasheet (PDF)

MADP-011034-10720T Non-Magnetic MELF PIN Diode Features ♦ Non-Magnetic Package for MRI Applications ♦ Rectangular MELF Ceramic Package ♦ Hermetically Sealed ♦ RoHS Compliant Rev V2 Package Style 1072 Description The MADP-011034-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-011034-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons o.

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MADP-011034-10720T Non-Magnetic MELF PIN Diode Features ♦ Non-Magnetic Package for MRI Applications ♦ Rectangular MELF Ceramic Package ♦ Hermetically Sealed ♦ RoHS Compliant Rev V2 Package Style 1072 Description The MADP-011034-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-011034-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed component that has extremely low electromagnetic permeability. Incorporated in the package is a glass passivated CERMA chip that is full face bonded on the cathode and anode which maximizes the surface contact area to minimize the electrical and thermal resistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. Application The MADP-011034-10720T is designed for circuit protection and the tuning of RF coil designs in MRI applications. When connected in an anti-parallel configuration these PIN diodes provide excellent protection from long RF pulses and transient voltage spikes. Absolute Maximum Ratings1,2,3@ 25°C Parameter Reverse DC & AC Voltage 1,2 D.C. Forward Current1,2 Peak A.C. Forward Surge Current ( 8.3 mS Single Half Sine Wave )1,2 C.W. Power Dissipation 1,2,3 Operating Temperature1,2 Storage Temperature1,2 Mounting Temperature1,2 Absolute Maximum |-150 V| 0.5 A 2.5 A 6.0 W -65°C to +150°C -65°C to +175°C +260°C for 30 s Designed for Automated Assembly This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are well suited for most key jaw or vacuum pick-up techniques. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. 1. Exceeding these limits may cause permanent damage 2. Values will de-rate over temperature. 3. Infinite Heat Sink, de-rate to 0W @ +175 °C , by –40mW/°C from 25°C to +175 °C RoHS The MADP-011034-10720T is fully RoHS compliant meaning that it contains less than the maximum allowable concentration of 0.1% by weight for lead, PBB, PBDE, and 0.01% of cadmium and hexavalent chromium at raw homogeneous materials level. There is less than 100ppm of mercury and no mercury was intentionally added to the component. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outl.


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