Miniature ChipLED
HSMQ-C280 Miniature ChipLED Data Sheet
Features LED with InGaN die Surface mount device with 0402 footprint Compa...
Description
HSMQ-C280 Miniature ChipLED Data Sheet
Features LED with InGaN die Surface mount device with 0402 footprint Compatible with reflow soldering Tape in 8mm carrier tape on a 7 inch diameter reel
Applications Backlighting Indicator
Package Dimensions
Note: 1. All dimensions are in millimeters (inches). 2. Tolerance ±0.1mm (±0.004in) unless otherwise specified.
Caution: LEDs are class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
1
Absolute Maximum Value at TJ = 25°C
Parameter
Green
Forward Current1
20
Peak Pulsing Current2
100
Power Dissipation
78
LED Junction Temperature
95
Operating Temperature Range
-30 to 85
Storage Temperature Range
-40 to 85
Note:
1. Derate as shown in Figure 6. 2. Pulse condition of 1/10 duty and 0.1ms width.
Unit mA mA mW °C °C °C
Optical/Electrical Characteristics at TJ = 25°C, IF=20mA
Parameter
Min Typ Max Unit
Luminous Intensity Iv1
112.5
222.8
mcd
Peak Wavelength λp
516 nm
Dominant Wavelength λd2
522
nm
Viewing Angle 2θ1/23
130 °
Forward Voltage Vf
2.7
3.9 V
Reverse Voltage Vr4 at Ir=100μA
5
V
Thermal Resistance Rθj-p
300
°C/W
Note:
1. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis.
2. The dominant wavelength is derived from the CIE Chromaticity Diagram and...
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