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M93C76-DRE Dataheets PDF



Part Number M93C76-DRE
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description EEPROM
Datasheet M93C76-DRE DatasheetM93C76-DRE Datasheet (PDF)

M93Cx6-DRE 16-Kbit, 8-Kbit, 4-Kbit, 2-Kbit and 1-Kbit (8-bit or 16-bit wide) MICROWIRE™ serial EEPROM 105 °C operation Datasheet - production data SO8 (MN) 150 mil width TSSOP8 (DW) 169 mil width WFDFPN8 (MF) DFN8 - 2 x 3 mm Features • Industry standard MICROWIRE™ bus • Memory array: 1 Kb, 2 Kb, 4 Kb, 8 Kb or 16 Kb • Dual organization: by word (x16) or byte (x8) • Write – Byte within 4 ms – Word within 4 ms • READY/BUSY signal during programming • 2 MHz clock rate • Sequential read operation .

  M93C76-DRE   M93C76-DRE


Document
M93Cx6-DRE 16-Kbit, 8-Kbit, 4-Kbit, 2-Kbit and 1-Kbit (8-bit or 16-bit wide) MICROWIRE™ serial EEPROM 105 °C operation Datasheet - production data SO8 (MN) 150 mil width TSSOP8 (DW) 169 mil width WFDFPN8 (MF) DFN8 - 2 x 3 mm Features • Industry standard MICROWIRE™ bus • Memory array: 1 Kb, 2 Kb, 4 Kb, 8 Kb or 16 Kb • Dual organization: by word (x16) or byte (x8) • Write – Byte within 4 ms – Word within 4 ms • READY/BUSY signal during programming • 2 MHz clock rate • Sequential read operation • Single supply voltage: 1.7 V to 5.5 V • Extended temperature range: -40 °C up to 105 °C • Enhanced ESD protection • Write cycle endurance – 4 million Write cycles at 25 °C – 1.2 million Write cycles at 85 °C – 900 k Write cycle at 105°C • Data retention – more than 50 years at 105 °C – 200 years at 55 °C • Packages – RoHS-compliant and Halogen-free (ECOPACK2®) Table 1. Device summary Reference Part number M93Cx6-DRE M93C46-DRE M93C56-DRE M93C66-DRE M93C76-DRE M93C86-DRE February 2017 This is information on a product in full production. DocID028496 Rev 2 1/32 www.st.com Contents Contents M93Cx6-DRE 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Connecting to the serial bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.1 Operating supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.2 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.3 Power-up and device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.4 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.1 Read Data from Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2 Erase and Write data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2.1 Write Enable and Write Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2.2 Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2.3 Write All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.2.4 ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 15 5.2.5 Erase Byte or Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2.6 Erase All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 READY/BUSY status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 Common I/O operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9 Clock pulse counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 11 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/32 DocID028496 Rev 2 M93Cx6-DRE Contents 12 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.1 SO8N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.2 TSSOP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 12.3 WFDFPN8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 13 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 DocID028496 Rev 2 3/32 3 List of tables List of tables M93Cx6-DRE Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Memory size versus organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Signal names . . . . . . . . . . . .


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