Document
SPC560D30x SPC560D40x
32-bit MCU family built on the Power Architecture® for automotive body electronics applications
Datasheet production data
LQFP100 (14 x 14 x 1.4 mm)
LQFP64 (10 x 10 x 1.4 mm)
Features
AEC-Q100 qualified
High-performance up to 48 MHz e200z0h CPU – 32-bit Power Architecture® technology CPU – Variable length encoding (VLE)
Memory – Up to 256 KB Code Flash with ECC – Up to 64 (4x16) KB Data Flash with ECC – Up to 16 KB SRAM with ECC
Interrupts – 16 priority levels – Non-maskable interrupt (NMI) – Up to 38 external interrupts including 18 wakeup lines
16-channel eDMA
GPIOs: 45 (LQFP64), 79 (LQFP100)
Timer units – 4-channel 32-bit periodic interrupt timers – 4-channel 32-bit system timer module – System watchdog timer – 32-bit real-time clock timer
16-bit counter time-triggered I/Os – Up to 28 channels with PWM/MC/IC/OC – 5 independent counters – 27-channels with ADC trigger capability
12-bit analog-to-digital converter (ADC) with up to 33 channels – Up to 61 channels via external multiplexing – Individual conversion registers
– Cross triggering unit (CTU)
Dedicated diagnostic module for lighting – Advanced PWM generation – Time-triggered diagnostics – PWM-synchronized ADC measurements
Communications interfaces – 1 FlexCAN interface (2.0B active) with 32 message buffers – 3 LINFlex/UART, 1 with DMA capability – 2 DSPI
Clock generation – 4 to 16 MHz fast external crystal oscillator – 16 MHz fast internal RC oscillator – 128 kHz slow internal RC oscillator – Software-controlled FMPLL – Clock monitoring unit
Exhaustive debugging capability – Nexus1 on all packages – Nexus2+ available on emulation device (SPC560B64B2-ENG)
On-chip CAN/UART bootstrap loader
Low power capabilities – Several low power mode configurations – Ultra-low power standby with RTC, SRAM and CAN monitoring – Fast wakeup schemes
Single 5 V or 3.3 V supply
Operates in ambient temperature range of -40 to 125 °C
Table 1. Device summary
Package
Part number
128 Kbyte code Flash
256 Kbyte code Flash
LQFP100 LQFP64
SPC560D30L3 SPC560D30L1
SPC560D40L3 SPC560D40L1
November 2018
This is information on a product in full production.
DS6494 Rev 8
1/82
www.st.com
1
Contents
Contents
SPC560D30x, SPC560D40x
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Pad configuration during reset phases . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Voltage supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.5 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.6 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.3.1 NVUSRO[PAD3V5V] field description . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.3.2 NVUSRO[OSCILLATOR_MARGIN] field description . . . . . . . . . . . . . . . 25
4.3.3 NVUSRO[WATCHDOG_EN] field description . . . . . . . . . . . . . . . . . . . . 25
4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.5 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.6 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.6.1 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.6.2 Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.7 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.7.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..