CP2012-20A0897

CP 2012 Series Multilayer Chip Couplers Features  Monolithic SMD with small, low-profiled, and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc. Specifications ACX Advanced Ceramic X Part Number Passband (MHz) Insertion Loss Return Loss (dB) (dB) CP2012- 880 ~ 20A0897_ 915 Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity 0.5 max. : 4000 : -40 ~ +85 ℃ : -40 ~ +85 ℃ : 12 months max. : 2W max. 14.0 min. Coupling (dB) 20.0  1.0 Part Number CP 2012 - 20 A   0897  /LF   Isolation (dB) 25.0 min.  Type CP : Coupler  Dimensions ( L × W ) 2.0 × 1.25 mm  Coupling  Central Frequency  Soldering 20 : 20dB  Specification Code 0897 : 897MHz  Packaging =lead-containing /LF=lead-free A T: Tape & Reel B: Bulk Terminal Configuration       No. Terminal Name No. Terminal Name  IN  Termination  GND  GND  Main Out  Coupled Out CP2012-20A0897T/LF REV:2 PAGE:1/7 Dimensions and Recommended PC Board Pattern ACX Advanced Ceramic X ap Unit : mm Mark Dimensions W T c L gb L 2.0  0.1 W 1.25  0.1 T 0.95  0.1 a 0.3  0.1 b 0.2  0.1 c 0.3+0.1 /-0.2 g 0.35  0.1 p 0.65  0.05 0.65 0.35 * 0.2 * 1.0 0.8 * * 0.25 0.3 Solder Resist Land Through-hole ( 0.3) * Line width should be designed to match 50characteristic impedance, depending on PCB material and thickness. Measuring ...