Power MOSFET
IRF9910TRPbF-1
VDS RDS(on) m ax Q1 (@VGS = 10V) RDS(on) m ax Q2 (@VGS = 10V) Qg (typical) Q1 Qg (typical) Q2
ID(@TA = 2...
Description
IRF9910TRPbF-1
VDS RDS(on) m ax Q1 (@VGS = 10V) RDS(on) m ax Q2 (@VGS = 10V) Qg (typical) Q1 Qg (typical) Q2
ID(@TA = 25°C)Q1
ID(@TA = 25°C)Q2
20 V
13.4 mΩ
9.3
7.4 15
nC
10
A 12
S2 1 G2 2 S1 3 G1 4
HEXFET® Power MOSFET
8 D2 7 D2 6 D1 5 D1
SO-8
Applications
l Dual SO-8 MOSFET for POL converters in desktop, servers, graphics cards, game consoles and set-top box
Features Industry-standard pinout SO-8 Package
Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free MSL1, Industrial qualification
Benefits ⇒ Multi-Vendor Compatibility
Easier Manufacturing Environmentally Friendlier
Increased Reliability
Base Part Number IRF9910PbF-1
Package Type SO-8
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number IRF9910TRPbF-1
Absolute Maximum Ratings
Parameter
VDS Drain-to-Source Voltage
VGS ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C PD @TA = 70°C
Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V
cContinuous Drain Current, VGS @ 10V
Pulsed Drain Current
Power Dissipation Power Dissipation
TJ TSTG
Linear Derating Factor Operating Junction and
Storage Temperature Range
Q1 Max.
Q2 Max.
20
± 20
10 12 8.3 9.9
83 98
2.0
1.3
0.016 -55 to + 150
Units V
A W
W/°C °C
Thermal Resistance
Parameter RθJL Junction-to-Drain Lead
fgRθJA Junction-to-Ambient
Notes through
are on page 11
Typ. ––– –––
Max. 42 62.5
Units °C/W
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October 16, 2014
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