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PHT
Vishay Sfernice
High Stability - High Temperature (230 °C) Thin Film Wraparound Chip Resistors, Sulfur Resistant
INTRODUCTION
For applications such as down hole applications, the need for parts able to withstand very severe conditions (temperature as high as 215 °C powered or up to 230 °C un-powered) has leaded Vishay Sfernice to push out the limit of the thin film technology. Designers might read the application note: Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (P, PRA etc…) (High Temperature Application) www.vishay.com/doc?53047 in conjunction with this datasheet to help them to properly design their PCBs and get the best performances of the PHT.
Vishay Sfernice R&D engineers will be willing to support any customer design considerations.
FEATURES
• Operating temperature range: -55 °C; +215 °C
• Storage temperature: -55 °C; +230 °C
• Gold terminations (< 1 μm thick)
• 5 sizes available (0402, 0603, 0805, 1206, 2010); other sizes upon request
• Temperature coefficient down to 15 ppm (-55 °C; +215 °C)
• Tolerance down to 0.01 %
• Load life stability: 0.35 % max. after 2000 h at 220 °C (ambient) at Pn
• Shelf life stability: 0.7 % typ. (1 % max.) after 15 000 h at 230 °C
• SMD wraparound
• TCR remains constant after long term storage at 230 °C (15 000 h)
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE RANGE
RATED POWER (1)(2)
P215 °C W
LIMITING ELEMENT VOLTAGE V
TOLERANCE (2) ±%
TEMPERATURE COEFFICIENT (3)
± ppm/°C
PHT0402 PHT0603
0402 0603
10 to 130K 10 to 320K
0.0189 0.0375
50 0.01, 0.02, 0.05, 0.1, 0.5, 1 10, 15, 25, 30, 50, 55 75 0.01, 0.02, 0.05, 0.1, 0.5, 1 10, 15, 25, 30, 50, 55
PHT0805 0805 10 to 720K
0.06
150 0.01, 0.02, 0.05, 0.1, 0.5, 1 10, 15, 25, 30, 50, 55
PHT1206 PHT2010
1206 2010
10 to 2.7M 10 to 7.5M
0.1 0.2 (4)
200 0.01, 0.02, 0.05, 0.1, 0.5, 1 10, 15, 25, 30, 50, 55 300 0.01, 0.02, 0.05, 0.1, 0.5, 1 10, 15, 25, 30, 50, 55
Notes
(1) For power handling improvement, please refer to application note 53047: “Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications)” www.vishay.com/doc?/53047 and consult Vishay Sfernice
(2) See Table 2 on next page (3) See Table 1 on next page (4) It is possible to dissipate up to 0.3 W, but there will be an additional drift of 0.1 % after load life
CLIMATIC SPECIFICATIONS
Operating temperature range
-55 °C; +215 °C
Storage temperature range
-55 °C; +230 °C
PERFORMANCE VS. HUMID SULFUR VAPOR
Test conditions
50 °C ± 2 °C, 85 % ± 4 % RH, exposure time 500 h
Test results
Resistance drift < (0.05 % R + 0.05 ), no corrosion products observed
MECHANICAL SPECIFICATIONS
Substrate Resistive Element
Alumina Nichrome (NiCr)
Passivation Protection Terminations
Silicon nitride (Si3N4) Epoxy + silicone
Gold (< 1 μm) over nickel barrier
Note • For other terminations, please consult
Revision: 14-Jan-15
1 Document Number: 53050
For technical questions, contact:
[email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com
PHT
Vishay Sfernice
TABLE 1 - TEMPERATURE COEFFICIENT
10 ppm/°C Y
15 ppm/°C 25 ppm/°C E 30 ppm/°C 50 ppm/°C H 55 ppm/°C
-55 °C; +155 °C -55 °C; +215 °C -55 °C; +155 °C -55 °C; +215 °C -55 °C; +155 °C -55 °C; +215 °C
TABLE 2 - BEST TOLERANCE AND TCR VS. OHMIC VALUE
SERIES
RANGE ()
TOL. (± %)
10 to < 100
0.05; 0.1; 0.5; 1
0402
100 to < 90K
0.01; 0.02; 0.05; 0.1; 0.5; 1
90K to 130K
0.01; 0.02; 0.05; 0.1; 0.5; 1
10 to < 100
0.05; 0.1; 0.5; 1
0603
100 to < 210K
0.01; 0.02; 0.05; 0.1; 0.5; 1
210K to 320K
0.01; 0.02; 0.05; 0.1; 0.5; 1
10 to < 100
0.05; 0.1; 0.5; 1
0805
100 to < 480K
0.01; 0.02; 0.05; 0.1; 0.5; 1
480K to 720K
0.01; 0.02; 0.05; 0.1; 0.5; 1
10 to < 100
0.05; 0.1; 0.5; 1
1206
100 to < 1.8M
0.01; 0.02; 0.05; 0.1; 0.5; 1
1.8M to 2.7M
0.01; 0.02; 0.05; 0.1; 0.5; 1
10 to < 100
0.05; 0.1; 0.5; 1
2010
100 to < 5M
0.01; 0.02; 0.05; 0.1; 0.5; 1
5M to 7.5M
0.01; 0.02; 0.05; 0.1; 0.5; 1
PHT STABILITY CURVE
2.0
High Temperature Drift vs. Time
1.8
1.6
1.4
Drift in %
1.2
1.0
0.8 With Pd
0.6 (Tj = 230 °C)
0.4
0.2
0.0 0
2000
4000
6000
8000
Time in h
Note • Stability will be dependent on resistivity of resistor. Above curves are worst case.
10 000
12 000
TCR CODE Y; E; H Y; E; H E; H Y; E; H Y; E; H E; H Y; E; H Y; E; H E; H Y; E; H Y; E; H E; H Y; E; H Y; E; H E; H
T = 230 °C
T = 215 °C T = 200 °C T = 185 °C
14 000
Revision: 14-Jan-15
2 Document Number: 53050
For technical questions, contact:
[email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN A.